GB/T 44924-2024 半导体集成电路 射频发射器/接收器测试方法
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- 更新时间：2025-03-11
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资料介绍
中华人民共和国国家标准
ICS 31.200
CCS L 56
GB/T 44924—2024
半导体集成电路射频发射器/接收器测试方法
Semiconductor integrated circuits—
Measuring methods for RF transmitter/receiver
2024⁃12⁃31 发布2025⁃04⁃01 实施
国家市场监督管理总局
国家标准化管理委员会
发 布
目 次
前言··························································································································Ⅲ
1 范围·······················································································································1
2 规范性引用文件········································································································1
3 术语和定义··············································································································1
4 一般要求·················································································································4
4.1 总则·················································································································4
4.2 环境要求···········································································································4
4.3 测试条件···········································································································4
4.4 测试系统及仪器设备····························································································4
4.5 测试注意事项·····································································································5
5 详细要求·················································································································5
5.1 动态功耗Pa（mW）································································································5
5.2 功率增益GP（dB）·································································································6
5.3 功率增益平坦度ΔGP（dB）····················································································10
5.4 线性功率增益GPLIN（dB）·······················································································11
5.5 线性功率增益平坦度ΔGPLIN（dB）···········································································11
5.6 输出功率Po（dBm）·····························································································12
5.7 抗烧毁功率PKSH（dBm）························································································13
5.8 效率η（%）········································································································14
5.9 功率增益可调范围GR（dB）··················································································15
5.10 镜像抑制比RIMJ（dBc）························································································16
5.11 谐波抑制比RHR（dBc）························································································17
5.12 本振抑制比RLO（dBc）························································································1
ICS 31.200
CCS L 56
GB/T 44924—2024
半导体集成电路射频发射器/接收器测试方法
Semiconductor integrated circuits—
Measuring methods for RF transmitter/receiver
2024⁃12⁃31 发布2025⁃04⁃01 实施
国家市场监督管理总局
国家标准化管理委员会
发 布
目 次
前言··························································································································Ⅲ
1 范围·······················································································································1
2 规范性引用文件········································································································1
3 术语和定义··············································································································1
4 一般要求·················································································································4
4.1 总则·················································································································4
4.2 环境要求···········································································································4
4.3 测试条件···········································································································4
4.4 测试系统及仪器设备····························································································4
4.5 测试注意事项·····································································································5
5 详细要求·················································································································5
5.1 动态功耗Pa（mW）································································································5
5.2 功率增益GP（dB）·································································································6
5.3 功率增益平坦度ΔGP（dB）····················································································10
5.4 线性功率增益GPLIN（dB）·······················································································11
5.5 线性功率增益平坦度ΔGPLIN（dB）···········································································11
5.6 输出功率Po（dBm）·····························································································12
5.7 抗烧毁功率PKSH（dBm）························································································13
5.8 效率η（%）········································································································14
5.9 功率增益可调范围GR（dB）··················································································15
5.10 镜像抑制比RIMJ（dBc）························································································16
5.11 谐波抑制比RHR（dBc）························································································17
5.12 本振抑制比RLO（dBc）························································································1